| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin curing agent maintaining little coloring due to deterioration by a high energy light source, having excellent crack resistance to the change of a temperature condition, etc., and giving a cured product excellent in transparency upon curing, and to provide an epoxy resin composition, a cured product of the epoxy resin composition, and an optical semiconductor device sealed with the cured product. <P>SOLUTION: The epoxy resin curing agent contains a polycarboxylic acid anhydride and a siloxane structure-containing polymer, wherein the siloxane structure-containing polymer is preferably a siloxane structure-containing polyester. <P>COPYRIGHT: (C)2013,JPO&INPIT |
