| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the stress generated at the time of joining an element to a bump acts on the element, to suppress variations of the quality of an electronic part, and to increase a manufacturing yield in the electronic part in which the element is mounted on a substrate via the bump. <P>SOLUTION: An electronic part comprises: a substrate 11 having a first planar surface; a bump 14 fixed to the first planar surface of the substrate 11; and an element 12 which is out of contact with and opposite to the first planar surface of the substrate 11, is fixed to the bump 14 by adhesion, and has a slit 30 in the vicinity of a region adhering to the bump 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
