发明名称 SAW DEVICE, SAW OSCILLATOR, AND ELECTRONIC APPARATUS
摘要 A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1<D/W1&nlE;1.6. The fixing member bonds the lower surface and side surfaces of the fixed end of the SAW chip to the base substrate.
申请公布号 US2013027144(A1) 申请公布日期 2013.01.31
申请号 US201213557748 申请日期 2012.07.25
申请人 SEIKO EPSON CORPORATION;YAMANAKA KUNIHITO;OBATA NAOHISA 发明人 YAMANAKA KUNIHITO;OBATA NAOHISA
分类号 H03B5/32;H01L41/04 主分类号 H03B5/32
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