发明名称 |
SAW DEVICE, SAW OSCILLATOR, AND ELECTRONIC APPARATUS |
摘要 |
A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1<D/W1≦̸1.6. The fixing member bonds the lower surface and side surfaces of the fixed end of the SAW chip to the base substrate.
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申请公布号 |
US2013027144(A1) |
申请公布日期 |
2013.01.31 |
申请号 |
US201213557748 |
申请日期 |
2012.07.25 |
申请人 |
SEIKO EPSON CORPORATION;YAMANAKA KUNIHITO;OBATA NAOHISA |
发明人 |
YAMANAKA KUNIHITO;OBATA NAOHISA |
分类号 |
H03B5/32;H01L41/04 |
主分类号 |
H03B5/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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