发明名称 VAPOR CHAMBER HAVING HEATED PROTRUSION
摘要 A vapor chamber is configured to conduct heat generated by a heat-generating element and includes a bottom plate, a first wick structure, a second wick structure, a cover plate and a working fluid filled between the cover plate and the bottom plate. One side of the bottom plate has a heated protrusion in thermal contact with the heat-generating element, and the other side is formed with an accommodating trough corresponding to the heated protrusion. The first wick structure is provided in the accommodating trough. The second wick structure is disposed on the bottom plate and provided with an opening and a plurality of airflow channels in communication with the opening. The cover plate tightly covers the bottom plate. The supporting posts are sandwiched between the cover plate and the first wick structure. By this arrangement, the mounting and heat-conducting of the heat-generating element can be achieved.
申请公布号 US2013025829(A1) 申请公布日期 2013.01.31
申请号 US201113191005 申请日期 2011.07.26
申请人 KUNSHAN JUE-CHUNG ELECTRONICS CO.,;HUANG YU- PO 发明人 HUANG YU- PO
分类号 F28D15/04 主分类号 F28D15/04
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