MOUNTING SUBSTRATE AND LIGHT-EMITTING MODULE

摘要

Provided are a mounting substrate and a light-emitting module such that heat radiation can be improved. The mounting substrate (2) is provided with: a heat transfer plate (21) that is formed of metal, and that can have electronic parts mounted on one side thereof; a wiring board (22) with wiring patterns (22b), onto which the electronic parts can be connected, formed on one face of an organic insulation substrate (22a), said wiring board (22) being arranged on the other side of the heat transfer plate (21); and an insulation layer (23) interposed between the heat transfer plate (21) and the wiring board (22). The heat transfer plate (21) has formed thereon through holes (21b) exposing portions of the wiring patterns (22b) where the electronic parts are to be connected. In the mounting substrate (2), the planar size of the wiring board (22) to be larger than the planar size of the heat transfer plate (21), and the wiring patterns (22b) of the wiring board (22) are spread out to areas where the wiring patterns (22b) will not be superimposed upon the heat transfer plate (21). The light-emitting module is configured by mounting solid-state light emitting elements (3) onto the mounting substrate (2) as the electronic parts.