| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide precursor resin composition for a flexible device substrate, which includes a water solvent and is good in environmental adaptability, and a method for manufacturing an aromatic polyimide flexible device using an aqueous solution composition of a polyimide precursor. <P>SOLUTION: The polyimide precursor resin composition for a flexible device substrate is prepared by homogeneously dissolving a polyamic acid composed of a repeating unit represented by chemical formula (1) together with imidazoles of ≥0.8 equivalent times the carboxyl group of the polyamic acid, in a water solvent. In the chemical formula (1), A is a tetravalent group obtained by eliminating the carboxyl group from an aromatic tetracarboxylic acid, and B is a divalent group obtained by eliminating an amino group from an aromatic diamine which has a solubility at 25°C to water of ≥0.1 g/L. <P>COPYRIGHT: (C)2013,JPO&INPIT |
