WIRING BOARD AND ELECTRONIC DEVICE

摘要

[Problem] To provide a wiring board of excellent reliability wherein fully satisfactory application of a plating layer onto a metallic surface layer is achieved. [Solution] A wiring board is provided with: an insulating substrate (11); a heat-radiating member (12) containing Cu, that is provided in the insulating substrate (11) so as to be partially exposed from the insulating substrate (11); a metallic surface layer (13) containing Mo as the chief constituent, having a surface portion containing Cu, and provided on the surface of the insulating substrate (11) adjacent to the heat-radiating member (12) so as to cover the heat-radiating member (12); and a plating layer (16) that is provided on the metallic surface layer. The Cu portions that are contained in the heat-radiating member (12) and the Cu portions that are contained in the surface portion are connected.