| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for preventing a rise of an electronic circuit component by means different from a conventional case and to provide an electronic circuit manufacturing system for performing the method. <P>SOLUTION: If the chip component 56 is placed in an attaching position which is set in a component attaching program (figure 11(b)) when a printing amount of solder 340 to pads 46 on which two electrodes 58 of the chip component 56 are placed lacks (figure 11(a)), surface tension of the solder 340 acting on the electrode 58 when fusing the solder is larger as the printing amount is larger and the risk of rise may occur in the chip component 56. The surface tension is larger as an area of an overlapped portion in a plan view of the solder 340 printed on the two pads 46 and the two electrodes 58 is larger, and the placing position of the chip component 56 is set to be a position where a ratio of a printing area of the two portions of solder 340 is in inverse proportion to a ratio of two overlap areas within a setting error range (figure 11(c)). Thus, the surface tensions acting on the two electrodes become almost equal and the rise is prevented. <P>COPYRIGHT: (C)2013,JPO&INPIT |
