A METHOD FOR BONDING SUBSTRATES USING A UV RADIATION CURING-REDOX CURING ADHESIVE SYSTEM
摘要
<p>The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.</p>
申请公布号
WO2013013589(A1)
申请公布日期
2013.01.31
申请号
WO2012CN78807
申请日期
2012.07.18
申请人
HENKEL (CHINA) COMPANY LIMITED;ATTARWALA, SHABBIR;ZHOU, NICOLAS;YUAN, JIMMY;LU, DANIEL;SONG, CHONGJIAN
