发明名称 |
THE THIN COPPER STYLE PATTERN CIRCUIT BOARD FIXATION MANUFACTURING METHOD OF LED ILLUMINATING SYSTEM HEAT DISSIPATION ABSENCES OF THE FLUORESCENT LAMP TYPE WHICH ATTACHES |
摘要 |
PURPOSE: A method for manufacturing a radiating member for a fluorescent light type LED lighting device in which a thin copper style pattern circuit substrate is set is provided to directly fix a thin copper substrate for a printed circuit on a bottom surface of the radiating member having plural radiating pins by using a setting device. CONSTITUTION: A radiating member(110) having plural radiating pins and flat surfaces is manufactured(S110). A thin copper style pattern circuit member(120) arraying plural LED lamps is manufactured(S120). The thin copper style pattern circuit member is temporarily attached to the flat surface of the radiating member through a pressurizing roller(130)(S130). The radiating member is cut in a usable length through a cutting unit having a cutting blade(S140). The thin copper style pattern circuit member is fixed to the cut radiating member with pressure(S150). [Reference numerals] (S110) Step of manufacturing; (S120) Step of manufacturing a copper foil pattern circuit member; (S130) Step of pressurizing; (S140) Step of cutting; (S150) Step of fixing; (S151) Step of fixing; (S152) Step of sealing; (S153) Step of bonding; (S154) Step of discharging |
申请公布号 |
KR101228436(B1) |
申请公布日期 |
2013.01.31 |
申请号 |
KR20110124106 |
申请日期 |
2011.11.25 |
申请人 |
JUNG, KI SUK;ID CO., LTD. |
发明人 |
JUNG, KI SUK |
分类号 |
F21V29/00;F21Y101/02 |
主分类号 |
F21V29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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