| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device with high reliability in which when trying to suppress deformation due to the difference of coefficients of thermal expansion between the through electrode and a substrate or the like, the degradation of device characteristics due to a side surface shape of a through electrode can be suppressed without increasing a number of steps of a manufacturing process. <P>SOLUTION: An electronic device includes: a substrate 1; wiring 18 formed above a surface of the substrate 1; and a through-via 30 penetrating the substrate 1 from a back surface of the substrate 1, and formed in a through-hole 1A in which a first opening hole 1Aa and a second opening hole 1Ab having a total area of the opening smaller than the first opening hole 1Aa are connected in a depth direction of the substrate 1. In the through-via 30, a first electrode portion 30a formed in the first opening hole 1Aa and a second electrode portion 30b formed in the second opening hole 1Ab are integrally formed on the outermost side surfaces. <P>COPYRIGHT: (C)2013,JPO&INPIT |
