发明名称 |
THERMOELECTRIC CONVERSION ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion element with improved utility as an element module which has an enhanced performance index by utilizing a Fe<SB POS="POST">2</SB>VAl based alloy thin film under conditions where its thermal conductivity is lowered. <P>SOLUTION: The thermoelectric conversion element has a structure where a unit structure consisting of a thermoelectric conversion material layer 202 and a conductive buffer layer 203 is stacked repeatedly multiple times over a buffer layer 201 formed on a substrate 200. Each of the thermoelectric conversion material layers comprises a Full-Heusler alloy or a Full-Heusler alloy thin film having a thickness of 1-200 nm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013021089(A) |
申请公布日期 |
2013.01.31 |
申请号 |
JP20110152460 |
申请日期 |
2011.07.11 |
申请人 |
HITACHI LTD |
发明人 |
NISHIDE AKISATO;KUROSAKI YOSUKE;HAYAKAWA JUN;YABUUCHI MAKOTO;OKAMOTO MASAKUNI |
分类号 |
H01L35/32;C22C38/00;H01L35/20 |
主分类号 |
H01L35/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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