| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit in which the ESD protection circuit between different types of power supply between a common discharge path can be disposed closely to the pads of respective power supplies. <P>SOLUTION: A semiconductor integrated circuit 1 includes an I/O cell IOC1 for power supply having a pad P, and an ESD protection circuit ESD1 for the power supply and being used for power supply of a VDDc system, and an I/O cell IOC2 for power supply having a pad P, an ESD protection circuit ESD1 for the power supply, and an ESD protection circuit ESD2 between different types of power supply and being used for power supply of VDDa, VDDb systems. The I/O cells IOC1 and IOC2 for power supply having external dimensions identical to those of the I/O cell IOC100 for signal input/output are arranged in the same row as the IOC100 arranged in row. A common discharge path CDL being connected with the ESD protection circuit ESD2 between different types of power supply of the I/O cell IOC2 for power supply penetrates the IOC100 arranged in row from the I/O cell IOC1 for power supply, and is wired to the I/O cell IOC2 for power supply. <P>COPYRIGHT: (C)2013,JPO&INPIT |
