发明名称 |
METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR AND STRUCTURE THEREOF |
摘要 |
A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.
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申请公布号 |
US2013027172(A1) |
申请公布日期 |
2013.01.31 |
申请号 |
US201213644964 |
申请日期 |
2012.10.04 |
申请人 |
CHIPBOND TECHNOLOGY CORPORATION;CHIPBOND TECHNOLOGY CORPORATION |
发明人 |
KUO CHIH-MING;HSU YOU-MING |
分类号 |
H01F5/00 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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