| 摘要 |
An electronic chip including a semiconductor substrate (1) covered with an insulating layer (4) including metal interconnection levels (3) and interconnection pillars (10) connected to said metal interconnection levels (3), said pillars (110) forming regions (111) protruding from the upper surface of said insulating layer (4) and capable of forming an electric contact, wherein said pillars (110) have a built-in portion (115) in a housing formed across the thickness of at least said insulating layer (4).
|
