| 摘要 |
PURPOSE: A double-sided flip chip package is provided to mount the same integrated circuit dies on a module PCB and to improve the degree of integration. CONSTITUTION: A module PCB(100) includes a first surface, a second surface and a first set of electrical conductors(130). The electrical conductors are electrically connected to an electronic device module. A first die is electrically connected to the module PCB through the flip chip interconnection of the first surface of the module PCB. A second die is electrically connected to the module PCB through a flip chip interconnection of the second surface of the module PCB. The first set of the electrical conductors electrically connects the electronic device module to a module including a SOC(system on a chip). |
