CONTACT STRUCTURE FOR INSPECTION, AND PROBE CARD

摘要

Inspection of electric properties is stably performed on a wafer having very fine electrodes at a narrow pitch. An inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicon substrate. The silicon substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them. The conductive portions on the lower side absorb variations in height of the electrode pads, and the conductive portions on the upper side absorb distortion and deflection on the circuit board side, whereby contact between the conductive portions and the electrode pads is maintained.