发明名称 Continuous process for the manufacture of substrates for printed wire boards
摘要 A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres and the fibres are positioned in at least two crossing directions, whereupon the filaments layers provided with matrix material, optionally together with one or more electrical conducting layers, such as a metal foil, and/or insulating layers on one or on either outer side, are passed through a preferably heated laminating zone, such as a double belt press, characterized in that use is made of filaments-containing layers made up of a plurality of mutually parallel filaments that are not bonded in the form of a fabric and extend substantially linearly.
申请公布号 US5269863(A) 申请公布日期 1993.12.14
申请号 US19920989736 申请日期 1992.12.10
申请人 AKZO NV 发明人 MIDDELMAN, ERIK
分类号 B29C67/20;B29C70/20;B29C70/50;H05K1/03;(IPC1-7):H05K3/02;H05K3/46;B32B31/20 主分类号 B29C67/20
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