INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICALINTERCONNECTS AND METHOD OF MANUFACTURE THEREOF

摘要

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND METHOD OF MANUFACTURE THEREOFA method of manufacture of an integrated circuit packaging system includes: providing a first substrate; attaching vertical interconnects along a periphery of the first substrate; mounting an integrated circuit over the first substrate, the integrated circuit surrounded by the vertical interconnects; and mounting a second substrate directly on the vertical interconnects and the integrated circuit.(Fig 1)