发明名称 METHOD FOR FORMING A CONTACT HOLE AND ETCHER FOR FORMING THE SAME
摘要 PURPOSE: A method for forming a contact hole and an etching apparatus for forming the same are provided to form a high quality metal line by using contact holes and to improve the degree of integration. CONSTITUTION: A substrate(100) is loaded within a chamber. An etch stopper layer, an inter-layer insulating layer, a mask layer and photoresist pattern are successively formed on the substrate. A DC voltage is applied to the upper electrode and two different high frequency powers respectively are applied to the bottom electrode to generate plasma. While the temperature of the chamber side wall is maintained in the range of 200 to 100°C, a reaction gas is flowed to the chamber to etch the mask layer and the inter-layer insulating layer. The etch stopper layer is etched to form a contact hole(122).
申请公布号 KR20130011569(A) 申请公布日期 2013.01.30
申请号 KR20110072808 申请日期 2011.07.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHANG, CHONG KWANG;OH, YOUNG MOOK;LEE, JUNG HOON;AHN, HAK YOON
分类号 H01L21/28;H01L21/3065 主分类号 H01L21/28
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