| 摘要 |
Disclosed are a light emitting device package and a lighting system. The light emitting device package (100) includes a first cavity (125) in a first region of the body (110); a second cavity (135) in a second region of the body (110); first and second lead frames (121, 131) spaced apart from each other in the first cavity (125); a third lead frame (141) spaced apart from the second lead frame (131) in the second cavity (135); a first LED chip (151) on the first and second lead frames (121, 131) in the first cavity (125); a second LED chip (152) on the second and third lead frames (131, 141) in the second cavity (135); and a molding member (161, 162) in the first and second cavities (125, 135). |
