发明名称 |
METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES |
摘要 |
<p>One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.</p> |
申请公布号 |
SG186359(A1) |
申请公布日期 |
2013.01.30 |
申请号 |
SG20120092235 |
申请日期 |
2011.07.01 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
KOLICS, ARTUR;REDEKER, FRITZ |
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