发明名称 MULTI-CHANNEL PACKAGE AND ELECTRONIC SYSTEM COMPRISING THE SAME PACKAGE
摘要 PURPOSE: A multi-channel package and an electronic system comprising the same package are provided to perform a high speed operation by reducing a line length between an exterior controller and the multi-channel package. CONSTITUTION: An SSD(Solid State Drive) apparatus(1000) includes a mainboard(500), a multi-channel package(100) and a controller package(300). The multi-channel package includes multiple semiconductor chips and outer connectors having four channels. The multi-channel package is mounted on the mainboard. The controller package includes 4n channels(n is an integer) for controlling the multi-channel package. The controller package is mounted on mainboard.
申请公布号 KR20130011422(A) 申请公布日期 2013.01.30
申请号 KR20110072570 申请日期 2011.07.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KIL SOO;YOUN, SUN PIL
分类号 H01L25/18;H01L23/48;H01L23/52 主分类号 H01L25/18
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