发明名称 |
MULTI-CHANNEL PACKAGE AND ELECTRONIC SYSTEM COMPRISING THE SAME PACKAGE |
摘要 |
PURPOSE: A multi-channel package and an electronic system comprising the same package are provided to perform a high speed operation by reducing a line length between an exterior controller and the multi-channel package. CONSTITUTION: An SSD(Solid State Drive) apparatus(1000) includes a mainboard(500), a multi-channel package(100) and a controller package(300). The multi-channel package includes multiple semiconductor chips and outer connectors having four channels. The multi-channel package is mounted on the mainboard. The controller package includes 4n channels(n is an integer) for controlling the multi-channel package. The controller package is mounted on mainboard. |
申请公布号 |
KR20130011422(A) |
申请公布日期 |
2013.01.30 |
申请号 |
KR20110072570 |
申请日期 |
2011.07.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, KIL SOO;YOUN, SUN PIL |
分类号 |
H01L25/18;H01L23/48;H01L23/52 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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