| 摘要 |
PURPOSE: A heating treatment apparatus is provided to reduce particles generated in a heating process and prevent the particles from being adhering to a substrate. CONSTITUTION: An elevating unit moves a wafer boat(3A) up and down in a heating furnace(2). A cover(61) covers an opening part when the wafer boat is positioned in the lower part of the heating process furnace. A cover mobile unit moves the cover near the opening part. A particle removal unit is installed in a loading room and removes particles on the cover.
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