发明名称 POLISHING AGENT AND METHOD FOR SUBSTRATE
摘要 PURPOSE: A polishing agent and a polishing method of a substrate are provided to provide a cobalt layer excellent corrosion resistance while maintaining sufficient polishing rate. CONSTITUTION: A polishing agent for polishing a cobalt-containing layer comprises: a carboxylic acid derivative which has at least one carboxylic acid selected from a phthalic acid compound, an isophthalic acid compound, an alkyldicarboxylic acid compound indicated in chemical formula 1: HOOC-R-COOH, and a salt and acid anhydride thereof; a metal anticorrosive agent; and water. The pH of the polishing agent is 4.0 or less. In chemical formula 1, R is a C4-10 alkylene group. A polishing method of a substrate comprises: a step of polishing at least one cobalt-containing polishing target film on the substrate(1) by using the polishing agent to remove residual parts except for a part containing cobalt atoms.
申请公布号 KR20130011943(A) 申请公布日期 2013.01.30
申请号 KR20120078157 申请日期 2012.07.18
申请人 HITACHI CHEMICAL CO., LTD. 发明人 MISHIMA KOUJI;TOBITA AYAKO
分类号 C09K3/14;H01L21/306 主分类号 C09K3/14
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