发明名称 |
METHODS, DEVICES, AND MATERIALS FOR METALLIZATION |
摘要 |
A method of making an electronic device which in one embodiment comprises providing a substrate, electrolessly depositing a barrier metal at least on portions of the substrate, and using wet chemistry such as electroless deposition to deposit a substantially gold-free wetting layer having solder wettability onto the barrier metal. An electronic device which in one embodiment comprises a metallization stack. The metallization stack comprises a barrier metal deposited electrolessly and a substantially gold-free wetting layer deposited on the barrier metal, and the wetting layer is wettable by solder. |
申请公布号 |
SG186360(A1) |
申请公布日期 |
2013.01.30 |
申请号 |
SG20120092243 |
申请日期 |
2011.06.30 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
KOLICS, ARTUR;LEE, WILLLIAM, T.;REDEKER, FRITZ |
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