发明名称 |
Integrated circuit package and method of forming an integrated circuit package |
摘要 |
An integrated circuit package is described. The integrated circuit package comprises a substrate having a plurality of sides, where each pair of adjacent sides forms a corner; a die coupled to a first surface of the substrate; a lid having a first portion positioned over the die and a plurality of foot portions, each foot portion of the plurality of foot portions being coupled to the first surface of the substrate at a corresponding corner of the substrate, where a side of the integrated circuit package above the substrate and between two associated foot portions has an opening; and a plurality of contact elements coupled to a second surface of the substrate. A method of forming an integrated circuit package is also shown.
|
申请公布号 |
US8362609(B1) |
申请公布日期 |
2013.01.29 |
申请号 |
US20090607019 |
申请日期 |
2009.10.27 |
申请人 |
XILINX, INC.;DOSDOS S. GABRIEL R.;KIM DONG WOOK |
发明人 |
DOSDOS S. GABRIEL R.;KIM DONG WOOK |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|