发明名称 Laser processing method
摘要 A laser processing method which can highly accurately cut objects to be processed having various laminate structures is provided. An object to be processed comprising a substrate and a laminate part disposed on the front face of the substrate is irradiated with laser light L while a light-converging point P is positioned at least within the substrate, so as to form a modified region due to multiphoton absorption at least within the substrate, and cause the modified region to form a starting point region for cutting. When the object is cut along the starting point region for cutting, the object 1 can be cut with a high accuracy.
申请公布号 US8361883(B2) 申请公布日期 2013.01.29
申请号 US20050507392 申请日期 2005.04.08
申请人 HAMAMATSU PHOTONICS K.K.;FUKUYO FUMITSUGU;FUKUMITSU KENSHI 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENSHI
分类号 H01L21/00;B23K26/38;B23K26/40;B28D1/22;B28D5/00;C03B33/02;C03B33/033;C03B33/07;H01L21/301 主分类号 H01L21/00
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