发明名称 |
Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material |
摘要 |
Semiconductor devices and assemblies including interconnects and methods for forming such interconnects are disclosed herein. One embodiment of a method of manufacturing a semiconductor device includes forming a plurality of first side trenches to an intermediate depth in a molded portion of a molded wafer having a plurality of dies arranged in rows and columns. The method also includes removing material from a second side of the molded portion at areas aligned with the first side trenches, wherein removing the material forms openings through the molded portion. The method further includes forming a plurality of electrical contacts at the second side of the molded portion at the openings and electrically connecting the second side contacts to corresponding bond-sites on the dies. |
申请公布号 |
US8362594(B2) |
申请公布日期 |
2013.01.29 |
申请号 |
US201113074938 |
申请日期 |
2011.03.29 |
申请人 |
MICRON TECHNOLOGY, INC.;CHUA SWEE KWANG;BOON SUAN JEUNG;CHIA YONG POO |
发明人 |
CHUA SWEE KWANG;BOON SUAN JEUNG;CHIA YONG POO |
分类号 |
H01L21/44;H01L21/31;H01L21/469 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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