| 摘要 |
PURPOSE: A polishing apparatus and a polishing method are provided to improve productivity by maintaining the surface of a polishing pad at a preset temperature to improve a polishing rate. CONSTITUTION: A pad temperature control device(20) controls the temperature of a surface(2a) of a polishing pad(2) by spraying gas to the polishing pad. The pad temperature control device is installed on the upper side of the polishing pad and includes a manifold(21) and a plurality of gas spray nozzles(22). The manifold is extended in a radial direction of the polishing pad in parallel to the surface of the polishing pad. The gas spray nozzle is attached to the lower side of the manifold with a preset space. [Reference numerals] (AA) Rotation direction |
