CYLINDRICAL SPUTTERING TARGET AND MANUFACTURING METHOD OF THIN FILM USING THE SAME
摘要
PURPOSE: A cylindrical sputtering target and a thin film manufacturing method using the same are provided to improve the production efficiency of a thin film by preventing the fault of stripe form generated on a base board by a connection part between unit target materials and obtain the quality of a thin film better than one big cylindrical sputtering target by a cylindrical sputtering target using a unit target material. CONSTITUTION: A cylindrical sputtering target comprises a cylindrical backing tube(100) and multiple unit target materials(200). Multiple unit target materials(210,220) are welded with each other and are adhered to the cylindrical backing tube. A connection part between unit target materials is unparallel to the heading direction of a base board. A connection part between unit target materials forms an oblique line to the heading direction of a base board. A connection part between unit target materials forms a spiral along the outer circumference surface of the cylindrical backing tube. A target material and a cylindrical backing tube are adhered by a bonding material. A bonding material includes minimum indium metal within a range in which a tin metal and an indium metal are mixed but an existing bonding process is not changed. A bonding material contains tin metal below 55-65 weight % against the total weight and is implemented below 140-160 deg. C of melting point.
申请公布号
KR20130010600(A)
申请公布日期
2013.01.29
申请号
KR20110071325
申请日期
2011.07.19
申请人
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
发明人
YOON, HAN HO;PARK, JU OK;KIM, JAE SEON;PARK, HYUNG RYUL;PARK, HOON