| 摘要 |
A semiconductor package and a method of formation thereof are provided to implement the high speed operation using an interposer without changing the design of the memory device and the logic device. A semiconductor package comprises the printed circuit board(10), the first semiconductor chip(20), and the chip package(P1). The first semiconductor chip is formed on the printed circuit board. The first semiconductor chip comprises the lower surface adjacent to the printed circuit board and the upper side faced to the lower surface. The chip package is formed on the first semiconductor chip. The chip package is electrically directly connected to the upper side of the first semiconductor chip. |
