发明名称 Bottom-up assembly of structures on a substrate
摘要 Examples of the present invention include methods of assembling structures, such as nanostructures, at predetermined locations on a substrate. A voltage between spaced-apart electrodes supported by substrate attracts the structures to the substrate, and positional registration can be provided the substrate using topographic features such as wells. Examples of the present invention also include devices, such as electronic and optoelectronic devices, prepared by such methods.
申请公布号 US8361297(B2) 申请公布日期 2013.01.29
申请号 US20090351509 申请日期 2009.01.09
申请人 THE PENN STATE RESEARCH FOUNDATION;MAYER THERESA S.;KEATING CHRISTINE D.;LI MINGWEI;MORROW THOMAS;KIM JAEKYUN 发明人 MAYER THERESA S.;KEATING CHRISTINE D.;LI MINGWEI;MORROW THOMAS;KIM JAEKYUN
分类号 B01D57/02;G01N27/453 主分类号 B01D57/02
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