发明名称 Polyamide resin and hinged molded product
摘要 A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit wherein a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 60:40; a vibration-welded molded product having an excellent vibration welding strength, a hinged molded product and a binding band having an excellent low-temperature toughness, and a filament having an excellent transparency which are obtained from the polyamide resin; and a hinged molded product comprising a polyamide resin constituted of an adipic acid unit and a pentamethylenediamine unit.
申请公布号 US8362191(B2) 申请公布日期 2013.01.29
申请号 US20100662600 申请日期 2010.04.26
申请人 MITSUBISHI CHEMICAL CORPORATION;MIYAMOTO MASAAKI;HITOMI TATSUYA;NISHIDA YUUICHI 发明人 MIYAMOTO MASAAKI;HITOMI TATSUYA;NISHIDA YUUICHI
分类号 C08G69/02;C08G69/26;C08G69/28;C08L77/00;C08L77/04;C08L77/06;C08L79/02;C12N15/00;C12P13/00;D01F6/80 主分类号 C08G69/02
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