发明名称 |
On-chip radiation dosimeter |
摘要 |
A method for forming a semiconductor device includes forming an implant mask on a substrate, such that a first portion of the substrate is located under the implant mask, and a second portion of the substrate is exposed; performing oxygen ion implantation of the substrate; removing the implant mask; and forming a first field effect transistor (FET) on the first portion of the substrate, and forming a second FET on the second portion of the substrate, wherein the second FET has a higher radiation sensitivity than the first FET.
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申请公布号 |
US8361829(B1) |
申请公布日期 |
2013.01.29 |
申请号 |
US201113222790 |
申请日期 |
2011.08.31 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;GORDON MICHAEL S.;RODBELL KENNETH P.;YAU JENG-BANG |
发明人 |
GORDON MICHAEL S.;RODBELL KENNETH P.;YAU JENG-BANG |
分类号 |
H01L23/552;G01T1/24;H01L27/14;H01L31/08 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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