发明名称 On-chip radiation dosimeter
摘要 A method for forming a semiconductor device includes forming an implant mask on a substrate, such that a first portion of the substrate is located under the implant mask, and a second portion of the substrate is exposed; performing oxygen ion implantation of the substrate; removing the implant mask; and forming a first field effect transistor (FET) on the first portion of the substrate, and forming a second FET on the second portion of the substrate, wherein the second FET has a higher radiation sensitivity than the first FET.
申请公布号 US8361829(B1) 申请公布日期 2013.01.29
申请号 US201113222790 申请日期 2011.08.31
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;GORDON MICHAEL S.;RODBELL KENNETH P.;YAU JENG-BANG 发明人 GORDON MICHAEL S.;RODBELL KENNETH P.;YAU JENG-BANG
分类号 H01L23/552;G01T1/24;H01L27/14;H01L31/08 主分类号 H01L23/552
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