发明名称 |
PHOTOCURABLE RESIN COMPOSITION |
摘要 |
<p>PURPOSE: A photocurable resin composition is provided to prevent an expensive base plate from being fouled or damaged by excellent releasing performance with a base plate stamp when applied to an imprint lithography mold. CONSTITUTION: A photocurable resin composition comprises: polyaliphatic aromatic silsesquioxane which contains an ethylenically unsaturated group indicated in chemical formula 1, and a fluorine group; a reactive monomer which contains one or more unsaturated groups in one molecule; an organic silane-based compound, and a photoinitiator. In chemical formula 1, each of R^1-R^4 is hydrogen or a C1-20 alkyl group or alkoxy group which is substituted or unsubstituted by fluorine, C6-20 aromatic group or a C2-20 ethylenic unsaturated group, n is an integer from 1-30, and each of R^5-R^8 is hydrogen, a C1-20 alkyl group or alkoxy group.</p> |
申请公布号 |
KR20130010583(A) |
申请公布日期 |
2013.01.29 |
申请号 |
KR20110071298 |
申请日期 |
2011.07.19 |
申请人 |
DONGJIN SEMICHEM CO., LTD. |
发明人 |
NAM, DONG JIN;KIM, DOO SHIK;KIM, BYUNG UK;PARK, KYUNG MIN;YOO, JAE WON |
分类号 |
C08L83/08;C08G77/04;C08K5/54;G03F7/004 |
主分类号 |
C08L83/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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