发明名称 |
Electronic component module and method for manufacturing the same |
摘要 |
An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.
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申请公布号 |
US8363422(B2) |
申请公布日期 |
2013.01.29 |
申请号 |
US20090540721 |
申请日期 |
2009.08.13 |
申请人 |
TAIYO YUDEN CO., LTD.;SAKINADA KAORU;ODA YASUYUKI |
发明人 |
SAKINADA KAORU;ODA YASUYUKI |
分类号 |
H05K7/14;H05K7/18 |
主分类号 |
H05K7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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