INTEGRATED CIRCUIT PROCESS YIELD ENHANCING TECHNIQUE FOR REDUCING UNDESIRED WATER CONTENT HOLDING OF DIELECTRIC AND HYDROGEN DISCHARGE DIFFUSION INFLUENCE

摘要

PROBLEM TO BE SOLVED: To reduce harmful influence of water content contaminants by passivating an integrated circuit involving a first and second layers to partly absorb contaminants existing on the second layer by the first layer. SOLUTION: An integrated circuit 10 has one element partly surrounded by a first layer, say inter-layer dielectric layer 30 having a relatively high contaminant absorption. This layer 30 is annealed to partly remove water contained therein. A second layer, say, an inter-layer ferroelectric glass layer 34 having a relatively low contaminant absorption is laminated adjacent the dielectric layer 30. On dielectric layer 30 and a ferroelectric glass layer 34, a passivation layer 66 is overlaid to partly absorb any of contaminants existing on the glass layer 34 by the dielectric layer 30.