发明名称 High strength and High electric conductive multi-layer copper sheets and manufacturing method of the same
摘要 In a high strength and high electrical conductive nano crystalline grain multi-layer copper alloy sheet, a plurality of high strength and high electrical conductive nano crystalline grain multi-layer manufactured by roll-bonding an oxygen free copper (OFC) alloy sheet and a deoxized low-phosphorous copper (DLP) alloy sheet are plastically bonded by roll-bonding method so that an OFC alloy layer and a DLP alloy layer are alternated to each other to have electrical conductivity of 85 IACS(%) or more and tensile strength of 500 MPa or more.
申请公布号 KR101227014(B1) 申请公布日期 2013.01.28
申请号 KR20110002941 申请日期 2011.01.12
申请人 发明人
分类号 B23K20/04 主分类号 B23K20/04
代理机构 代理人
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