| 摘要 |
<p>PURPOSE: A cutting apparatus and a substrate cutting method using the same are provided to shorten the time taken for a polishing process by implementing a polishing process during movement along a transferring rail. CONSTITUTION: A stage(600) moves according to a transfer rail(500). A polishing unit(700) is installed on the route of the transfer rail. The polishing unit polishes an edge of the substrate settled on the stage. The stage comprises a support plate and a rotating unit. The support plate is formed with an inserting hole in the central part. The rotating unit moves the substrate settled on the support plate in rotation vertically.</p> |
