FLIP CHIP TYPE LIGHT EMITTING DIODE DEVICE MODULE, SUBSTRATE MODULE USING MANUFACTURING OF THE SAME AND MANUFACTURING METHOD OF THE SAME

摘要

PURPOSE: A light emitting diode device assembly, a substrate assembly for manufacturing the same, and a manufacturing method thereof are provided to improve the reliability of an LED device assembly by maintaining a bonding state without change and using silicon. CONSTITUTION: A dam(120) is fixed to a substrate(110) using silicon and is formed on the substrate with a preset height. A light emitting diode device(130) is formed on the lower side of a bump to supply power. A conductive silicon resin(140) is located in the dam on the substrate. The conductive silicon resin electrically connects the light emitting diode device to the substrate.