| 摘要 |
A film adhesion apparatus is provided to exclude irradiation of intense ultra violet for solidifying photocation cure type epoxy resin system adhesive fully or heating after irradiation of ultra violet. A film adhesion apparatus comprises a hot lamp(2) for heating the photocation cure type epoxy resin-based adhesive present between film under temperature ranging from over 40 deg.c to less than the heat-resistance temperature of film; an ultra violet ray lamp(3) for solidifying the photocation cure type epoxy resin-based adhesive and then adhering the film. The heating lamp is a near infrared halogen lamp or a far infrared heater. |
