发明名称 STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS
摘要 <p>Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.</p>
申请公布号 KR20130010471(A) 申请公布日期 2013.01.28
申请号 KR20127025522 申请日期 2011.02.25
申请人 INNOVA DYNAMICS, INC. 发明人 MITTAL ALEXANDER CHOW;SRINIVAS ARJUN DANIEL;ROBINSON MATTHEW R.;YOUNG MICHAEL EUGENE
分类号 H01B5/14 主分类号 H01B5/14
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