发明名称 Method for fabricating thermopile and infrared sensor using SOI substrate
摘要 <p>PURPOSE: Methods for manufacturing a thermopile and an infrared sensor using an SOI(Silicon On Insulator) substrate are provided to have high sensitivity by having high Seebeck constant and high thermal resistance. CONSTITUTION: An SOI substrate(110) is prepared. A lower silicon layer(112), a first insulating layer(114) and an upper silicon layer(116) are successively laminated on the SOI substrate. P-type silicon strips and n-type silicon strips are formed. The p-type silicon strips and the n-type silicon strips are separated by patterning the upper silicon layer. A thermopile is formed by connecting metal electrode.</p>
申请公布号 KR101227242(B1) 申请公布日期 2013.01.28
申请号 KR20110010099 申请日期 2011.02.01
申请人 发明人
分类号 H01L31/09;H01L35/02 主分类号 H01L31/09
代理机构 代理人
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