| 摘要 |
<p>PURPOSE: A stacked semiconductor package is provided to minimize the number of I/O pins less than the number of stacked semiconductor dies by connecting semiconductor dies using a conductive wire or a conductive pattern. CONSTITUTION: A lead frame is composed of a paddle(110) and a lead(120). A substrate(130) is laminated on the paddle. A plurality of semiconductor dies(140) are laminated on the substrate. A passive device(150) is mounted on the substrate. A molding unit(160) is formed to protect the semiconductor dies.</p> |
