发明名称 Strain engineered composite semiconductor substrates and methods of forming same
摘要 Composite substrates are produced that include a strained Ill-nitride material seed layer on a support substrate. Methods of producing the composite substrate include developing a desired lattice strain in the Ill-nitride material to produce a lattice parameter substantially matching a lattice parameter of a device structure to be formed on the composite substrate. The Ill-nitride material may be formed with a Ga polarity or a N polarity. The desired lattice strain may be developed by forming a buffer layer between the Ill-nitride material and a growth substrate, implanting a dopant or introducing an impurity in the Ill-nitride material to modify its lattice parameter, or forming the Ill-nitride material with a coefficient of thermal expansion (CTE) on a growth substrate with a different CTE.
申请公布号 KR101226073(B1) 申请公布日期 2013.01.25
申请号 KR20117012475 申请日期 2008.12.19
申请人 发明人
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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