发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method, capable of precisely processing two parallel scribe lines having a narrow width for forming a terminal region in a short time. <P>SOLUTION: Each scribe unit includes a cutter wheel 230 and a scribe head 230a. At least one of the respective scribe units further includes a shift mechanism 213. The cutter wheel 230 rolls along a corresponding scribe schedule line out of a plurality of scribe schedule lines. The scribe head 230a is an element rotatably holding the cutter wheel 230 about an axial center substantially parallel to a Y-axis. The shift mechanism 213 moves the cutter wheel 230 in a direction substantially parallel to an X-axis direction. Accordingly, the distance between both the scribe schedule lines simultaneously rolled by using the adjacent scribe units is further narrowed in pitch. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013014107(A) 申请公布日期 2013.01.24
申请号 JP20110149853 申请日期 2011.07.06
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NISHIO JINKO;EDA TATSUO
分类号 B28D5/00;B28D1/24;C03B33/023;C03B33/03 主分类号 B28D5/00
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