发明名称 |
SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHODS THEREOF |
摘要 |
A semiconductor structure and a manufacturing method of the same are provided. The semiconductor structure includes a carrier. The carrier has a first surface and a second surface opposite to the first surface. The carrier includes an inner core layer and an exterior clad layer, and the inner core layer is covered by the exterior clad layer. |
申请公布号 |
US2013020710(A1) |
申请公布日期 |
2013.01.24 |
申请号 |
US201213556022 |
申请日期 |
2012.07.23 |
申请人 |
ADVANPACK SOLUTIONS PTE LTD.;CHEW JIMMY HWEE-SENG;FORTALEZA OVISO DOMINADOR JR.;LIM KIAN-HOCK;LIM SHOA-SIONG |
发明人 |
CHEW JIMMY HWEE-SENG;FORTALEZA OVISO DOMINADOR JR.;LIM KIAN-HOCK;LIM SHOA-SIONG |
分类号 |
H01L21/56;H01L21/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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