| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, and a semiconductor device using the same. <P>SOLUTION: The epoxy resin composition for sealing a semiconductor device includes an alicyclic diepoxy compound with the content of a stereoisomer having an exo-exo steric configuration accounting for 80% or more in the total amount of 4 stereoisomers represented by formula (I), (wherein R<SP POS="POST">1</SP>-R<SP POS="POST">12</SP>each independently represent a hydrogen atom, a halogen atom, or a 1-20C hydrocarbon group), a curing agent, a curing accelerator, and an inorganic filler. Also provided is a semiconductor device using the same. <P>COPYRIGHT: (C)2013,JPO&INPIT |
