| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree. <P>SOLUTION: A semiconductor element mounting member has, on a carrier substrate, a conductive metal layer pattern and an insulation part formed on a periphery edge of the conductive metal layer pattern. In the conductive metal layer pattern, an intended part on a surface opposite to the carrier substrate is exposed on the insulation part. The conductive metal layer pattern has a cross sectional shape at a periphery of the conductive metal layer pattern such that an outermost peripheral part protrudes from a part where the conductive metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side opposite to the carrier substrate of the conductive metal layer pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT |
